Double disk flat grinding

Double disk flat grinding is used wherever workpieces are surface ground on both sides. The achievable tolerance of the plane-parallel fine-ground workpieces is in the range of up to ±3µm with sometimes considerable stock removal rates in a single pass.

Whether in the automotive/supply industry, watchmaking, pump, valve and bearing production or in the defense industry – due to the high accuracy and flexibility, as well as the possible variety of materials (steel, ceramics, alloy materials, plastic, glass, …), double surface machining is used in numerous fields of application with throughput cycle times down to the tenth of a second range.

MEITEC technology:

In-process measurement with MEITEC SMK1

Position and wear monitoring of the grinding wheel(s) with MEITEC SMK1 grinding wheel measurement head

Post-process measurement with MEITEC EMK2C/PPSO and MEITEC EMK2C/PPSU

After surface grinding on both sides, each of the workpieces is measured in the MEITEC post-process measurement point.
The quality of the workpieces is evaluated and the process is analyzed and the corresponding correction values are transmitted to the machine control system.

Tilt adjustment and monitoring with MEITEC MT3F

The inclination (tilt) of the grinding wheels to each other required for the double surface grinding process is realized with adjustable tilt points, which are equipped with MEITEC MT3F axial probes.

Keeping an eye on the grinding process with the MEITEC CC17 HMI

The grinding process is not only optimally monitored at all times, but also clearly visualized. Therefore, an evaluation and, if necessary, a reaction – often during the automatic process – is feasible.

The dressing process, which is also crucial for a successful process, is also visualized in the MEITEC HMI and can be evaluated visually or automatically.

Double disk flat grinding – Supfina Planet V4 / Planet V7

MEITEC HMI display for double disk flat grinding applications (example)

Brake disk flat grinding

The friction surfaces on both functional sides of a brake disc are machined in a special double-sided grinding process.

The aim is to produce optimum surfaces that achieve an optimum braking effect on the one hand, but on the other hand achieve the lowest possible and therefore more environmentally friendly abrasion.

Brake disc surface grinding is typically used in the automotive and automotive supply industry.

MEITEC technology:

In-process measurement with MEITEC EMK2C/VSXO

Double-sided stock removal control with 2 MEITEC EMK2C/VDXO workpiece measuring heads.

Keeping an eye on the grinding process with the MEITEC CC08 HMI

The grinding process is monitored and visualized both in terms of thickness and removal per side.

In addition to the actual grinding process, it is possible to perform impact evaluations and visualize and evaluate structure-borne sound signals during positioning processes and during the grinding process.